2016 OCP Storage And Memory Data Center Developments

The Open Compute Project Conference was recently held in Silicon Valley. Storage and memory are important elements in data center infrastructure. This article will look at some of the related activities at the 2026 event.

First the OCP Foundation launched its OCP Nexus program to make 15 years of open hardware knowledge developed by the consortium easier to explore and use. This is an AI knowledge assistant to help engineers, architects, procurement teams and others find and explore the various OCP resources using natural-language conversations. Nexus brings a new way to navigate 15 years of specifications, reference designs, white papers and Summit content contributed by the OCP community, including for storage and memory products.

Koixia was showing their line of data center products at the show. These included a demo with Kioxia GP series SSDs using the company’s XL-Flash generation 3 NVMe designed for super high IOPS for near-GPU workloads. The demo showed 20+million input-output operations per second (MIOPS) 512-byte random read performance. The company was also showing the Kioxia NX1 series E1.S NVMe liquid cooled SSDs for data centers. The company also gave a talk on liquid cooling approaches for E1.S SSDs. Kioxia was also showing high density SSDs for data centers featuring their LD4 series E1.L NVMe SSDs. Images of these products are shown below.

OCP is also hosting specification work on high bandwidth flash, HBF, open standard development. HBF had been developed by Sandisk and SK hynix to create a 3D package that stacks up to 16 NAND flash die onto a logic base die and connected directly to accelerators, similar to high bandwidth memory, HBM, using stacks of DRAM die. The initial specification is meant for release in early 2027 with initial products available in 2028.